Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276587 | Wafer bonding method and apparatus with curved surfaces | Chih-Hui Huang, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2022-03-15 |
CT
Chun-Han Tsao
Overall (2022): #493,507 of 548,613Top 90%
1
Patents 2022