Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404470 | Method of forming deep trench isolation in radiation sensing substrate and image sensor device | Chi-Ming Lu, Jung-Chih Tsao, Yao-Hsiang Liang, Chih-Chang Huang, Ching-Ho Hsu | 2022-08-02 |
| 11387274 | Method of forming semiconductor device | Chi-Ming Lu, Sheng-Chan Li, Jung-Chih Tsao, Yao-Hsiang Liang | 2022-07-12 |
| 11276587 | Wafer bonding method and apparatus with curved surfaces | Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2022-03-15 |