Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532511 | Method for forming semiconductor structure | Gung-Pei Chang, Hai-Dang Trinh | 2022-12-20 |
| 11527713 | Top electrode via with low contact resistance | Bi-Shen Lee, Hai-Dang Trinh, Hsun-Chung Kuang, Tzu-Chung Tsai | 2022-12-13 |
| 11476337 | Method for forming a semiconductor structure | Gung-Pei Chang, Ching-Sheng Chu, Chern-Yow Hsu | 2022-10-18 |
| 11367623 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Hsun-Chung Kuang | 2022-06-21 |
| 11322464 | Film structure for bond pad | Julie Yang, Chii-Ming Wu, Tzu-Chung Tsai | 2022-05-03 |
| 11302663 | Film scheme for bumping | Chern-Yow Hsu, Cheng-Yuan Tsai, Kong-Beng Thei | 2022-04-12 |
| 11257997 | Semiconductor structure | Chia-Hua Lin, Chii-Ming Wu, Cheng-Yuan Tsai, Eugene Chen, Tzu-Chung Tsai | 2022-02-22 |