Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532698 | Diffusion barrier layer in top electrode to increase break down voltage | Hsing-Lien Lin, Hai-Dang Trinh, Fa-Shen Jiang | 2022-12-20 |
| 11527717 | Resistive memory cell having a low forming voltage | Hai-Dang Trinh, Hsing-Lien Lin, Tzu-Chung Tsai, Fa-Shen Jiang, Bi-Shen Lee | 2022-12-13 |
| 11482668 | RRAM structure | Hai-Dang Trinh, Hsing-Lien Lin, Fa-Shen Jiang | 2022-10-25 |
| 11479849 | Physical vapor deposition chamber with target surface morphology monitor | Hai-Dang Trinh, Shing-Chyang Pan | 2022-10-25 |
| 11476416 | Semiconductor device and method for manufacturing the same | Hai-Dang Trinh, Fa-Shen Jiang, Hsing-Lien Lin | 2022-10-18 |
| 11450555 | Method for forming semiconductor device having isolation structures with different thicknesses | Cheng-Ta Wu, Sen-Hong Syue, Cheng-Po Chau | 2022-09-20 |
| 11430729 | MIM capacitor with a symmetrical capacitor insulator structure | Hsing-Lien Lin, Cheng-Te Lee, Rei-Lin Chu, Yeur-Luen Tu, Chung-Yi Yu | 2022-08-30 |
| 11322464 | Film structure for bond pad | Julie Yang, Tzu-Chung Tsai, Yao-Wen Chang | 2022-05-03 |
| 11309491 | Data storage structure for improving memory cell reliability | Hai-Dang Trinh, Cheng-Yuan Tsai, Tzu-Chung Tsai, Fa-Shen Jiang | 2022-04-19 |
| 11271114 | Strained gate semiconductor device with oxygen-doped interlayer dielectric material | Cheng-Ta Wu, Shiu-Ko JangJian, Kun-Tzu Lin, Lan Chang | 2022-03-08 |
| 11257997 | Semiconductor structure | Chia-Hua Lin, Yao-Wen Chang, Cheng-Yuan Tsai, Eugene Chen, Tzu-Chung Tsai | 2022-02-22 |