Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450555 | Method for forming semiconductor device having isolation structures with different thicknesses | Cheng-Ta Wu, Chii-Ming Wu, Cheng-Po Chau | 2022-09-20 |
| 11302567 | Shallow trench isolation forming method and structures resulting therefrom | Szu-Ying Chen, Huicheng Chang, Yee-Chia Yeo | 2022-04-12 |