Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495489 | Method for forming a semiconductor-on-insulator (SOI) substrate | Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2022-11-08 |
| 11450555 | Method for forming semiconductor device having isolation structures with different thicknesses | Chii-Ming Wu, Sen-Hong Syue, Cheng-Po Chau | 2022-09-20 |
| 11398516 | Conductive contact for ion through-substrate via | Min-Ying Tsai, Yeur-Luen Tu | 2022-07-26 |
| 11362176 | RFSOI semiconductor structures including a nitrogen-doped charge-trapping layer and methods of manufacturing the same | Chiu Hua Chen | 2022-06-14 |
| 11329160 | FinFET gate structure | Shiu-Ko JangJian, Chung-Ren Sun, Ming-Te Chen, Ting-Chun Wang, Jun Cheng | 2022-05-10 |
| 11296209 | RF switch device with a sidewall spacer having a low dielectric constant | — | 2022-04-05 |
| 11289330 | Semiconductor-on-insulator (SOI) substrate and method for forming | Chia-Ta Hsieh, Kuo-Wei Wu, Yu-Chun Chang, Ying Ling Tseng | 2022-03-29 |
| 11271114 | Strained gate semiconductor device with oxygen-doped interlayer dielectric material | Chii-Ming Wu, Shiu-Ko JangJian, Kun-Tzu Lin, Lan Chang | 2022-03-08 |
| 11264469 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Chia-Shiung Tsai, Jiech-Fun Lu, Kuo-Hwa Tzeng, Shih Pei Chou, Yu-Hung Cheng +1 more | 2022-03-01 |
| 11232974 | Fabrication method of metal-free SOI wafer | Yu-Hung Cheng, Pu Chen, Po-Jung Chiang, Ru-Liang Lee, Victor Lu +4 more | 2022-01-25 |