Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522004 | Absorption enhancement structure for image sensor | Ching-Chung Su, Hung-Wen Hsu, Shih Pei Chou | 2022-12-06 |
| 11495489 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2022-11-08 |
| 11450700 | Semiconductor image sensor pixel isolation structure for reducing crosstalk | Tsun-Kai Tsao | 2022-09-20 |
| 11380728 | Charge release layer to remove charge carriers from dielectric grid structures in image sensors | Ching-Chung Su | 2022-07-05 |
| 11335726 | Lens structure configured to increase quantum efficiency of image sensor | Chun-Tsung Kuo | 2022-05-17 |
| 11315972 | BSI image sensor and method of forming same | Hung-Wen Hsu, Yeur-Luen Tu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng | 2022-04-26 |
| 11309342 | Dummy vertical transistor structure to reduce cross talk in pixel sensor | Tsun-Kai Tsao, Shih Pei Chou | 2022-04-19 |
| 11264469 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Kuo-Hwa Tzeng, Shih Pei Chou, Yu-Hung Cheng +1 more | 2022-03-01 |
| 11251213 | Concave reflector for complementary metal oxide semiconductor image sensor (CIS) | Po-Han Huang, Yu-Chun Chen | 2022-02-15 |
| 11233117 | Ring structure for film resistor | Chun-Tsung Kuo | 2022-01-25 |
| 11217547 | Bond pad structure with reduced step height and increased electrical isolation | Shih Pei Chou | 2022-01-04 |