Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495489 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou +1 more | 2022-11-08 |
| 11404465 | Epitaxial semiconductor liner for enhancing uniformity of a charged layer in a deep trench and methods of forming the same | Ru-Liang Lee, Yeur-Luen Tu | 2022-08-02 |
| 11264469 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuo-Hwa Tzeng, Shih Pei Chou +1 more | 2022-03-01 |
| 11232974 | Fabrication method of metal-free SOI wafer | Pu Chen, Cheng-Ta Wu, Po-Jung Chiang, Ru-Liang Lee, Victor Lu +4 more | 2022-01-25 |