Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532642 | Multi-function substrate | Eugene Chen, Kuan-Liang Liu, Szu-Yu Wang, Chia-Shiung Tsai, Chih-Ping Chao +1 more | 2022-12-20 |
| 11404465 | Epitaxial semiconductor liner for enhancing uniformity of a charged layer in a deep trench and methods of forming the same | Yu-Hung Cheng, Yeur-Luen Tu | 2022-08-02 |
| 11374000 | Trench capacitor with lateral protrusion structure | Ming Chyi Liu, Shih-Chang Liu | 2022-06-28 |
| 11362038 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu +2 more | 2022-06-14 |
| 11329148 | Semiconductor device having doped seed layer and method of manufacturing the same | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai | 2022-05-10 |
| 11232974 | Fabrication method of metal-free SOI wafer | Yu-Hung Cheng, Pu Chen, Cheng-Ta Wu, Po-Jung Chiang, Victor Lu +4 more | 2022-01-25 |