Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362038 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, De-Yang Chiou, Han-Jui Hu, Ching-Hung Wang +2 more | 2022-06-14 |
| 11276699 | Surface topography by forming spacer-like components | Chun-Chang Wu, Chihy-Yuan Cheng, Shun-Shing Yang, Wei-Lin Chang, Ching-Sen Kuo +2 more | 2022-03-15 |