Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522004 | Absorption enhancement structure for image sensor | Ching-Chung Su, Hung-Wen Hsu, Jiech-Fun Lu | 2022-12-06 |
| 11495489 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Yu-Hung Cheng +1 more | 2022-11-08 |
| 11309342 | Dummy vertical transistor structure to reduce cross talk in pixel sensor | Tsun-Kai Tsao, Jiech-Fun Lu | 2022-04-19 |
| 11264469 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuo-Hwa Tzeng, Yu-Hung Cheng +1 more | 2022-03-01 |
| 11244981 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang | 2022-02-08 |
| 11217547 | Bond pad structure with reduced step height and increased electrical isolation | Jiech-Fun Lu | 2022-01-04 |
| 11217621 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Chih-Yu Lai, Yen-Ting Chiang, Hsiao-Hui Tseng, Min-Ying Tsai | 2022-01-04 |