Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398516 | Conductive contact for ion through-substrate via | Cheng-Ta Wu, Yeur-Luen Tu | 2022-07-26 |
| 11232975 | Semiconductor-on-insulator (SOI) substrate having dielectric structures that increase interface bonding strength | Yeur-Luen Tu | 2022-01-25 |
| 11217621 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Chih-Yu Lai, Shih Pei Chou, Yen-Ting Chiang, Hsiao-Hui Tseng | 2022-01-04 |