Issued Patents 2022
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538837 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Feng-Chi Hung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2022-12-27 |
| 11532661 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu | 2022-12-20 |
| 11522002 | Method for forming semiconductor image sensor | Jhy-Jyi Sze, Yimin Huang | 2022-12-06 |
| 11502121 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung | 2022-11-15 |
| 11495630 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2022-11-08 |
| 11476295 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2022-10-18 |
| 11456176 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2022-09-27 |
| 11437420 | Image sensor with overlap of backside trench isolation structure and vertical transfer gate | Feng-Chi Hung, Jen-Cheng Liu, Wei Chuang Wu, Yen-Yu Chen, Chih-Kuan Yu | 2022-09-06 |
| 11430823 | Method for manufacturing semiconductor image sensor device having deep trench isolation | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Sheng-Chan Li, Yu-Jen Wang +3 more | 2022-08-30 |
| 11424228 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Jen-Cheng Liu, Hsing-Chih Lin, Ching-Chun Wang | 2022-08-23 |
| 11410972 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-08-09 |
| 11404534 | Backside capacitor techniques | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu | 2022-08-02 |
| 11387167 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2022-07-12 |
| 11342374 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung | 2022-05-24 |
| 11342373 | Manufacturing method of image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Ching-Chun Wang, Jen-Cheng Liu | 2022-05-24 |
| 11322481 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-05-03 |
| 11322540 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Jeng-Shyan Lin, Shyh-Fann Ting | 2022-05-03 |
| 11309348 | High density image sensor | Seiji Takahashi, Chen-Jong Wang, Jhy-Jyi Sze, Yimin Huang | 2022-04-19 |
| 11289455 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen +1 more | 2022-03-29 |
| 11282802 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Feng-Chi Hung, Sin-Yao Huang | 2022-03-22 |
| 11282769 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen | 2022-03-22 |
| 11257805 | Hybrid bonding with uniform pattern density | Szu-Ying Chen | 2022-02-22 |
| 11244925 | Semiconductor device structure with back-side layer to reduce leakage | Min-Feng Kao, Jen-Cheng Liu, Jeng-Shyan Lin, Hsun-Ying Huang | 2022-02-08 |
| 11244981 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2022-02-08 |
| 11227889 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2022-01-18 |