Issued Patents 2022
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222814 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Kuan-Chieh Huang | 2022-01-11 |
| 11222915 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Jeng-Shyan Lin, Shyh-Fann Ting | 2022-01-11 |
| 11217478 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Kuan-Chieh Huang | 2022-01-04 |