Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495630 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2022-11-08 |
| 11424228 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2022-08-23 |
| 11410972 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-08-09 |
| 11404460 | Vertical gate field effect transistor | Chun-Yuan Chen, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2022-08-02 |
| 11387167 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2022-07-12 |
| 11342373 | Manufacturing method of image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Jen-Cheng Liu, Dun-Nian Yaung | 2022-05-24 |
| 11322540 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting | 2022-05-03 |
| 11322481 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-05-03 |
| 11282802 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Dun-Nian Yaung, Feng-Chi Hung, Sin-Yao Huang | 2022-03-22 |
| 11244981 | Bond pad structure for bonding improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2022-02-08 |
| 11227889 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2022-01-18 |
| 11222915 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting | 2022-01-11 |