Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424228 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang | 2022-08-23 |
| 11410972 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-08-09 |
| 11404534 | Backside capacitor techniques | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2022-08-02 |
| 11387167 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang +1 more | 2022-07-12 |
| 11322481 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-05-03 |
| 11289455 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen +1 more | 2022-03-29 |
| 11282769 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen | 2022-03-22 |
| 11222814 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang | 2022-01-11 |
| 11217478 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang | 2022-01-04 |