Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508817 | Passivation layer for epitaxial semiconductor process | Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Po-Chun Liu, Kuan-Chieh Huang +2 more | 2022-11-22 |
| 11437708 | Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit | Po-Hsiang Huang, Fong-Yuan Chang, Tsui-Ping Wang | 2022-09-06 |
| 11387167 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang +1 more | 2022-07-12 |
| 11289455 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Ping-Tzu Chen +1 more | 2022-03-29 |
| 11282769 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Ping-Tzu Chen | 2022-03-22 |