Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424359 | Semiconductor device structure with high voltage device | Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin +4 more | 2022-08-23 |
| 11410972 | Hybrid bonding technology for stacking integrated circuits | Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-08-09 |
| 11342322 | Seal ring structures and methods of forming same | Kuan-Liang Liu, Wen-De Wang, Yung-Lung Lin | 2022-05-24 |
| 11322481 | Hybrid bonding technology for stacking integrated circuits | Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-05-03 |