Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538837 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2022-12-27 |
| 11502121 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung | 2022-11-15 |
| 11495630 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2022-11-08 |
| 11456176 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu | 2022-09-27 |
| 11437420 | Image sensor with overlap of backside trench isolation structure and vertical transfer gate | Dun-Nian Yaung, Jen-Cheng Liu, Wei Chuang Wu, Yen-Yu Chen, Chih-Kuan Yu | 2022-09-06 |
| 11342374 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2022-05-24 |
| 11342373 | Manufacturing method of image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Ching-Chun Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2022-05-24 |
| 11335716 | Photosensing pixel, image sensor and method of fabricating the same | Sin-Yao Huang, Chen-Hsien Lin, Tzu-Hsuan Hsu, Yan-Chih Lu | 2022-05-17 |
| 11282802 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Sin-Yao Huang | 2022-03-22 |
| 11244981 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Ming-Tsong Wang, Shih Pei Chou | 2022-02-08 |