Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322464 | Film structure for bond pad | Chii-Ming Wu, Tzu-Chung Tsai, Yao-Wen Chang | 2022-05-03 |
JY
Julie Yang
Overall (2022): #384,511 of 548,613Top 75%
1
Patents 2022