Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521846 | Methods for patterning a silicon oxide-silicon nitride-silicon oxide stack and structures formed by the same | Yi-Ren Wang | 2022-12-06 |
| 11371133 | Undercut-free patterned aluminum nitride structure and methods for forming the same | Yi-Ren Wang, Hung-Hua Lin | 2022-06-28 |
| 11292715 | Conductive bond structure to increase membrane sensitivity in MEMS device | Hung-Hua Lin, Chia-Ming Hung, Xin-Hua Huang | 2022-04-05 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Lan-Lin Chao +2 more | 2022-03-22 |