Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508562 | Low contamination chamber for surface activation | Ping-Yin Liu, Lee-Chuan Tseng, Lan-Lin Chao | 2022-11-22 |
| 11292715 | Conductive bond structure to increase membrane sensitivity in MEMS device | Hung-Hua Lin, Chia-Ming Hung, Yuan-Chih Hsieh | 2022-04-05 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2022-03-22 |
| 11222849 | Substrate loss reduction for semiconductor devices | Chung-Yi Yu, Kuei-Ming Chen | 2022-01-11 |