Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11371133 | Undercut-free patterned aluminum nitride structure and methods for forming the same | Yuan-Chih Hsieh, Yi-Ren Wang | 2022-06-28 |
| 11292715 | Conductive bond structure to increase membrane sensitivity in MEMS device | Chia-Ming Hung, Xin-Hua Huang, Yuan-Chih Hsieh | 2022-04-05 |
| 11279615 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng | 2022-03-22 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2022-03-22 |