Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11446851 | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2022-09-20 |
| 11309226 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai | 2022-04-19 |