Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515233 | Semiconductor component with cooling structure | Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao | 2022-11-29 |
| 11469200 | Semiconductor device and manufacturing method thereof | Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2022-10-11 |
| 11456256 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang, Wen-Lin Shih | 2022-09-27 |
| 11443981 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang | 2022-09-13 |
| 11410910 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung | 2022-08-09 |
| 11387164 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Sheng-Tsung Hsiao, Jen-Yu Wang | 2022-07-12 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Ching-Hua Hsieh, Chien Ling Hwang +2 more | 2022-05-24 |
| 11315900 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Chih-Hang Tung | 2022-04-26 |