Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410910 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Tung-Liang Shao, Chih-Hang Tung | 2022-08-09 |
| 11387164 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Jen-Yu Wang | 2022-07-12 |