Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456256 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Wen-Lin Shih | 2022-09-27 |
| 11443981 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao | 2022-09-13 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh +2 more | 2022-05-24 |