Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11494870 | Method and apparatus for reducing artifacts in projection-based frame | Jian-Liang Lin, Peng Wang, Ya-Hsuan Lee, Shen-Kai Chang | 2022-11-08 |
| 11467203 | Test circuit and method | Mill-Jer Wang, Ching-Nen Peng, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2022-10-11 |
| 11387683 | Composite integrated circuits and methods for wireless interactions therewith | Min-Jer Wang, Ching-Nen Peng, Chewn-Pu Jou, Feng-Wei Kuo, Hao Chen +4 more | 2022-07-12 |
| 11340291 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Ching-Nen Peng, Hao Chen | 2022-05-24 |
| 11249112 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Wei-Hsun Lin, Sen-Kuei Hsu, De-Jian Liu | 2022-02-15 |
| 11231453 | Alignment testing for tiered semiconductor structure | Mill-Jer Wang, Ching-Nen Peng, Hao Chen, Mincent Lee | 2022-01-25 |
| 11229109 | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface | Mill-Jer Wang, Ching-Nen Peng, Hao-Chiang Cheng | 2022-01-18 |