Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11448692 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Yung-Liang Kuo, Yinlung Lu | 2022-09-20 |
| 11386019 | Data protection method and storage device | Yu-Tien Chang, Ching-Ming Chen, Lin Hsu, Tsung-Wei Hung | 2022-07-12 |
| 11249112 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, De-Jian Liu | 2022-02-15 |