Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11448692 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2022-09-20 |
| 11361141 | Method and system for manufacturing a semiconductor device | Hsuan-Ming Huang, An Shun Teng, Mingni Chang, Ming-Yih Wang | 2022-06-14 |
| 11309258 | Semiconductor structure | Tung-Jiun Wu, Mingni Chang, Ming-Yih Wang | 2022-04-19 |