Issued Patents 2022
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296062 | Three-dimension large system integration | Chen-Hua Yu | 2022-04-05 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tzung-Hui Lee +1 more | 2022-03-29 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Yu-Chia Lai, Shih-Wei Chen | 2022-03-22 |
| 11239135 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Kuo Lung Pan, Po-Yuan Teng, Chi-Hui Lai | 2022-02-01 |