Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527466 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo | 2022-12-13 |
| 11404308 | Semiconductor package and method | Hung-Jui Kuo, Hui-Jung Tsai | 2022-08-02 |