Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393746 | Reinforcing package using reinforcing patches | Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2022-07-19 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin +1 more | 2022-03-22 |
| 11282803 | Device, semiconductor package and method of manufacturing semiconductor package | Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2022-03-22 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2022-03-01 |