Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532593 | Embedded stress absorber in package | Shin-Puu Jeng, Chien-Sheng Chen, Po-Yao Lin, Po-Chen Lai | 2022-12-20 |
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Yu-Sheng Lin, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2022-12-20 |
| 11527457 | Package structure with buffer layer embedded in lid layer | Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2022-12-13 |
| 11508710 | Method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2022-11-22 |
| 11450622 | Semiconductor package | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2022-09-20 |
| 11410939 | Chip package with lid | Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2022-08-09 |
| 11328971 | Semiconductor device and method of manufacture | Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2022-05-10 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Chia-Kuei Hsu, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2022-03-01 |