Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508710 | Method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2022-11-22 |
| 11410939 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2022-08-09 |