Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2022-03-01 |
CY
Che-Chia Yang
Overall (2022): #492,066 of 548,613Top 90%
1
Patents 2022