Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532593 | Embedded stress absorber in package | Shin-Puu Jeng, Chien-Sheng Chen, Po-Yao Lin, Shu-Shen Yeh | 2022-12-20 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin +1 more | 2022-03-22 |