Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11320733 | Reticle with conductive material structure | Hsiao-Lun Chang, Chueh-Chi Kuo, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2022-05-03 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Chen Lai, Po-Yao Lin +1 more | 2022-03-22 |