Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527474 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2022-12-13 |
| 11380666 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Liang Lin | 2022-07-05 |
| 11296065 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Techi Wong, Po-Yao Chuang, Shuo-Mao Chen | 2022-04-05 |