Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532569 | Method for manufacturing semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2022-12-20 |
DL
De-Dui Liao
Overall (2022): #475,287 of 548,613Top 90%
1
Patents 2022