JH

Jian-Wei Hong

TSMC: 2 patents #1,228 of 3,577Top 35%
Overall (2022): #147,558 of 548,613Top 30%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11373981 Package and manufacturing method thereof Ming-Fa Chen, Sung-Feng Yeh 2022-06-28
11227812 Package and manufacturing method thereof Ming-Fa Chen, Sung-Feng Yeh 2022-01-18