Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335656 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2022-05-17 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu | 2022-04-19 |