Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482499 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Ming-Fa Chen, Hsien-Wei Chen | 2022-10-25 |
| 11462458 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2022-10-04 |
| 11410929 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Ming-Fa Chen, Chin-Chou Liu +1 more | 2022-08-09 |
| 11387205 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2022-07-12 |
| 11342297 | Package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2022-05-24 |
| 11335656 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Ming-Fa Chen | 2022-05-17 |
| 11309243 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2022-04-19 |