Issued Patents 2022
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE49046 | Methods and apparatus for package on package devices | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang | 2022-04-19 |
| 11309291 | Die stack structure and manufacturing method thereof | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-04-19 |
| 11309289 | Integrated circuit package having heat dissipation structure | Ming-Fa Chen, Chen-Hua Yu | 2022-04-19 |
| 11309243 | Package having different metal densities in different regions and manufacturing method thereof | Jie Chen, Ming-Fa Chen, Sen-Bor Jan | 2022-04-19 |
| 11276656 | Integrated fan-out structure and method of forming | An-Jhih Su, Tsung-Shu Lin | 2022-03-15 |
| 11270989 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Ying-Ju Chen | 2022-03-08 |
| 11264343 | Bond pad structure for semiconductor device and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2022-03-01 |
| 11257787 | Package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh | 2022-02-22 |
| 11257791 | Stacked die structure and method of fabricating the same | Jie Chen, Ming-Fa Chen | 2022-02-22 |
| 11257775 | Mechanisms for forming post-passivation interconnect structure | Ying-Ju Chen | 2022-02-22 |
| 11251157 | Die stack structure with hybrid bonding structure and method of fabricating the same and package | Ching-Jung Yang | 2022-02-15 |
| 11251100 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure | Sheng-An Kuo, Ching-Jung Yang, Jie Chen, Ming-Fa Chen | 2022-02-15 |
| 11239225 | Three-dimensional integrated circuit structures and methods of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh | 2022-02-01 |
| 11217552 | Multi-chip integrated fan-out package | Jie Chen | 2022-01-04 |