Issued Patents 2022
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417610 | Post-passivation interconnect structure | Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2022-08-16 |
| 11417587 | Package structure and method of fabricating the same | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-08-16 |
| 11410956 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2022-08-09 |
| 11410948 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Jie Chen | 2022-08-09 |
| 11404404 | Semiconductor structure having photonic die and electronic die | Ming-Fa Chen | 2022-08-02 |
| 11393797 | Chip package with redistribution layers | Jie Chen | 2022-07-19 |
| 11387209 | Package structure | Sung-Feng Yeh, Ming-Fa Chen | 2022-07-12 |
| 11387204 | Semiconductor structure and method of fabricating the same | Jie Chen | 2022-07-12 |
| 11380653 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-07-05 |
| 11380598 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2022-07-05 |
| 11372160 | Package, optical device, and manufacturing method of package | Ming-Fa Chen | 2022-06-28 |
| 11373969 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Jie Chen | 2022-06-28 |
| 11373962 | Advanced seal ring structure and method of making the same | — | 2022-06-28 |
| 11373953 | Semiconductor structure and manufacturing method thereof | Ching-Jung Yang, Ming-Fa Chen | 2022-06-28 |
| 11362065 | Package and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2022-06-14 |
| 11362069 | Three-dimensional stacking structure and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2022-06-14 |
| 11362066 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen, Ming-Fa Chen | 2022-06-14 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Ching-Jung Yang, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-06-14 |
| 11355468 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2022-06-07 |
| 11347001 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen | 2022-05-31 |
| 11342297 | Package structure and manufacturing method thereof | Ming-Fa Chen, Jie Chen, Sen-Bor Jan, Sung-Feng Yeh | 2022-05-24 |
| 11342196 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2022-05-24 |
| 11335610 | Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same | Ching-Jung Yang, Jie Chen | 2022-05-17 |
| 11315855 | Package structure with photonic die and method | Ming-Fa Chen, Ying-Ju Chen | 2022-04-26 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hui Liu, Ching-Pin Yuan | 2022-04-19 |