Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh, Li-Han Hsu +3 more | 2022-11-29 |
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Chien-Chia Chiu
Overall (2022): #502,818 of 548,613Top 95%
1
Patents 2022