Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Tao-Sheng Chang | 2022-07-26 |