Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502050 | Redistribution layer metallic structure and method | Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2022-11-15 |
SB
Shih Wei Bih
Overall (2022): #264,562 of 548,613Top 50%
1
Patents 2022