Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502050 | Redistribution layer metallic structure and method | Shih Wei Bih, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2022-11-15 |
| 11411112 | Gate structure, method of forming the same, and semiconductor device having the same | Chun-Chieh Wang, Yueh-Ching Pai, Chi-Jen Yang | 2022-08-09 |
| 11373970 | Semiconductor device having a redistribution line | Anhao Cheng, Chun-Chang Liu | 2022-06-28 |