Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502050 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin | 2022-11-15 |
| 11437477 | Fluorine-free interface for semiconductor device performance gain | Yu-Ting Tsai, Chung-Liang Cheng, Hong-Ming Lo, Chyi-Tsong Ni | 2022-09-06 |
| 11396695 | Electromagnetic module for physical vapor deposition | Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen | 2022-07-26 |
| 11398393 | Vapor shield replacement system and method | Ping-Tse Lin, Wen-Cheng Lien, Monica Ho | 2022-07-26 |
| 11387123 | Metrology method in wafer transportation | Powen Huang, Yao-Yuan SHANG, Kuo-Shu Tseng, Yen-Yu Chen, Yi-Ming Dai | 2022-07-12 |
| 11381129 | Motor stator with winding configuration using hairpin wires | Hong-Cheng Sheu | 2022-07-05 |
| 11348811 | Thermal chamber exhaust structure and method | Hsien-Chang Hsieh, Tah-Te Shih, Wen-Hsong Wu, Chune-Te YANG, Yu-Jen Su | 2022-05-31 |
| 11222788 | Methods of enhancing surface topography on a substrate for inspection | Han-Wen Liao, Jun Liu | 2022-01-11 |